2687-0517
Computing, Telecommunication and Control
14
2
2021
1-93
RAR
RUS
8-15
Budanov
Dmitriy
dmitriy.budanov@gmail.com
Morozov
Dmitriy
dvmorozov@inbox.ru
Pilipko
M.M.
m_m_pilipko@rambler.ru
Digital MEMS microphones for remote monitoring system based on sound analysis
Sounds emitted by mechanisms and organisms contain information that can be used to diagnose the current state of an object and make predictions. There are known examples of the use of sound for diagnostics of pipelines, composite materials, industrial equipment. In most cases, devices with one sensor and limited functionality are used for this purpose, requiring a specialist to be in close proximity to the object under analysis. The system includes a set of digital microelectromechanical (MEMS) microphones, information from which is transmitted via Bluetooth to the mobile device. The system in a round-the-clock mode quickly registers changes in the spectrum of the sound signaland indicates possible malfunctions, damage to equipment and materials, etc. This allows preventing irreversible consequences. In this system, it is expedient to use digital MEMS microphones due to their low power consumption and low sensitivity to environmental influences, which is an important factor when deploying a remote monitoring system of industrial equipment.
10.18721/JCSTCS.14201
004.3
MEMS
digital microphone
piezoelectric microphone
capacitive microphone
Bluetooth
Bluetooth Low Energy
sound analysis
https://infocom.spbstu.ru/article/2021.69.1/
REV
RUS
16-28
Lysenko
Igor
Southern Federal University
ielysenko@sfedu.ru
Rostov-on-Don, Russian Federation
Tkachenko
Alexey
Southern Federal University
msqk@mail.ru
Rostov-on-Don, Russian Federation
Application of the RF MEMS technology in modern wireless systems: A potential that has not yet been fully realized
Today one of the key triggers of the development of research and development in the field of electronics, radio-frequency components, and systems, system integration and design, as well as information and communication technologies are such data network concepts as the Internet of Things, Internet of Everything, Tactical Internet and the most important among them is 5G – the 5th generation of mobile radio communications. This article presents a vision for the use of devices manufactured using microelectromechanical systems technology, namely passive radio-frequency microelectromechanical devices and systems in synergy with energy-harvesting microelectromechanical devices and systems in such new structural paradigms. The authors present their results on the development, manufacture and research of experimental samples of radio-frequency microelectromechanical switches that can meet the growing need for cutting-edge performance for currently deployed 5G NR FR1 (below 6 GHz) mobile networks or high-performance applications.
10.18721/JCSTCS.14202
621.318.51, 621.3.049.7
MEMS
RF MEMS
EH MEMS
microelectromechanical systems
radio-frequency
energy-harvesting
modern wireless systems
https://infocom.spbstu.ru/article/2021.69.2/
RAR
RUS
29-48
Zavorotneva
Ekaterina
Peter the Great St. Petersburg Polytechnic University
zavorotneva.ev@gmail.com
St. Petersburg, Russian Federation
Indeitsev
Dmitry
Peter the Great St. Petersburg Polytechnic University
Dmitry.indeitsev@gmail.com
St. Petersburg, Russian Federation
Lukin
Aleksei
Peter the Great St. Petersburg Polytechnic University
lukin@compmechlab.com
St. Petersburg, Russian Federation
Popov
Ivan
Peter the Great St. Petersburg Polytechnic University
popov_ia@spbstu.ru
St. Petersburg, Russian Federation
Udalov
Pavel
Peter the Great St. Petersburg Polytechnic University
pp_udalov@mail.ru
St. Petersburg, Russian Federation
Technique for compact modeling of thermoelectric systems
This article describes a technique for modeling a thermoelectric module (TEM) based on a systematic approach using compact models. A finite-element model of a Peltier battery was built in the COMSOL software environment. A numerical analysis of the characteristics of TEM in the case of the dependence of material parameters on temperature is carried out. A compact dynamic TEM model has been constructed and verified on the basis of direct numerical modeling of a number of stationary and non-stationary problems for TEM. The presented approach facilitates the modeling of a thermoelectric module and its interrelationships with control units and other thermal elements under various boundary and initial conditions. The simulation results are in good agreement with the results obtained using other models described in the literature, as well as with numerical solutions. Based on numerical experiments, it is noted that the dependence of the physical parameters of the Peltier battery on temperature can distort the output parameters of the TEM and, if possible, should be taken into account in a compact model.
10.18721/JCSTCS.14203
681.5.01
thermoelectric module
system reduction
compact model
Matlab
Comsol
sssMOR
https://infocom.spbstu.ru/article/2021.69.3/
RAR
RUS
49-64
Kazakin
Aleksey
keha@newmail.ru
Kleimanov
Roman
Peter the Great St. Petersburg Polytechnic University
kleimanovrv@mail.ru
St. Petersburg, Russian Federation
Korshunov
Andrey
Peter the Great St. Petersburg Polytechnic University
korshunov@spbstu.ru
St. Petersburg, Russian Federation
Akulshin
Yurii
Peter the Great St. Petersburg Polytechnic University
akulshin_yud@spbstu.ru
St. Petersburg, Russian Federation
Shashkin
Aleksandr
S.I. Vavilov State Optical Institute
shashkin@goi.ru
St. Petersburg, Russian Federation
MEMS alkali vapor cell encapsulation technologies for chip-scale atomic clock
The article is dedicated to solving the problem of creation of small-size quantum frequency standards for telecommunications and navigation systems using the methods of MEMS technologies. The analysis of the conventional MEMS atomic clocks operating on the effect of coherent population trapping shows that the conditions of the technological operation for alkali vapor cells sealing have the greatest influence on the clock performance. To improve the atomic clock short-term and long-term frequency stability, it is necessary to reduce the cell sealing temperature and use materials with low gas permeability. Therefore, experimental work was carried out to find new structural materials for the atomic cell design and two MEMS technologies of low-temperature anodic bonding were developed. The first one is based on the use of transparent glass-ceramics SO-33M and provides anodic sealing at a temperature of 150 °C. Using this technology, prototypes of MEMS cells with optical windows made of glass-ceramic and fused quartz were made. The second technology is based on the anodic bonding of LK5 glass and silicon at a temperature of 250 °C and was used to fabricate MEMS cells filled with vapors of rubidium-87 or caesium-133 isotopes in neon buffer gas.
10.18721/JCSTCS.14204
621.3
MEMS atomic clock
alkali vapor cell
anodic bonding
glass
glass-ceramics
quantum frequency standard
https://infocom.spbstu.ru/article/2021.69.4/
RAR
RUS
65-78
0000-0003-3103-7060
Loboda
Vera
Peter the Great St.Petersburg Polytechnic University
Polytechnicheskaya, 29, St.Petersburg, 195251, Russian Federation
Salamatova
Ulyana
Peter the Great St. Petersburg Polytechnic University
salamatova.uv@edu.spbstu.ru
St. Petersburg, Russian Federation
Capacitive MEMS microphones for medical applications
Microphones manufactured based on MEMS technology have been significantly applied in medicine. However, medical application requires more sensitive and low-frequency MEMS microphones. To achieve this goal capacitive microphones are the most appropriate as they have a low level of noise and high sensitivity compared to piezoelectric and piezoresistive microphones. The structure and materials enable to change electric parameters of microphones for better. To increase sensitivity it is possible to find a membrane structure when internal mechanical resistivity is minimal. When MEMS structures are ideally found, a frequencies range can be expanded. Membrane flexibility can be expanded by means of applying meshes at the edges, corrugations and springs.
10.18721/JCSTCS.14205
621.3.049.7
MEMS
capacitive microphone
low frequency microphone
sensitivity
membrans
https://infocom.spbstu.ru/article/2021.69.5/
RAR
RUS
79-92
Tulaev
Artyom
Concern CSRI Elektropribor, JSC
artulaev@gmail.com
St. Petersburg, Russian Federation
Styazhkina
Anna
Concern CSRI Elektropribor, JSC
anna_yakimov@mail.ru
St. Petersburg, Russian Federation
Kozlov
Alexey
Concern CSRI Elektropribor, JSC
kas573@yandex.ru
St. Petersburg, Russian Federation
Belyaev
Yakov
designcenter.spb@mail.ru
Micromechanical sensors design method based on system-level modeling
This paper proposes a design method for micromechanical inertial sensors with force feedback electromechanical loop with delta-sigma modulator. Development of such sensors requires application of modern design methods, including modeling at system level, model refinement based on results of finite element modeling and modeling of individual electronic blocks at circuit level, as well as implementation of a digital twin based on results of an experimental study of sensors samples. Such a complex approach to sensor design is caused by high requirements to sensor characteristics (both in terms of dynamic range and accuracy), the need to consider the impact of external factors and the various physics to describe the processes, the impossibility of rapid prototyping, the influence of technological process parameters on sensor characteristics, etc. In this regard, this paper proposes a comprehensive method for the design of micromechanical sensors based on the construction of the system model. This paper represents the results of an experimental study of the force feedback type sensor using the proposed method.
10.18721/JCSTCS.14206
531.383
micromechanical sensor
MEMS
delta-sigma modulator
system level model
digital twin
https://infocom.spbstu.ru/article/2021.69.6/