2687-0517 Computing, Telecommunication and Control 14 2 2021 1-93
RAR RUS 8-15 Budanov Dmitriy dmitriy.budanov@gmail.com Morozov Dmitriy dvmorozov@inbox.ru Pilipko M.M. m_m_pilipko@rambler.ru Digital MEMS microphones for remote monitoring system based on sound analysis Sounds emitted by mechanisms and organisms contain information that can be used to diagnose the current state of an object and make predictions. There are known examples of the use of sound for diagnostics of pipelines, composite materials, industrial equipment. In most cases, devices with one sensor and limited functionality are used for this purpose, requiring a specialist to be in close proximity to the object under analysis. The system includes a set of digital microelectromechanical (MEMS) microphones, information from which is transmitted via Bluetooth to the mobile device. The system in a round-the-clock mode quickly registers changes in the spectrum of the sound signaland indicates possible malfunctions, damage to equipment and materials, etc. This allows preventing irreversible consequences. In this system, it is expedient to use digital MEMS microphones due to their low power consumption and low sensitivity to environmental influences, which is an important factor when deploying a remote monitoring system of industrial equipment. 10.18721/JCSTCS.14201 004.3 MEMS digital microphone piezoelectric microphone capacitive microphone Bluetooth Bluetooth Low Energy sound analysis https://infocom.spbstu.ru/article/2021.69.1/
REV RUS 16-28 Southern Federal University Lysenko Igor ielysenko@sfedu.ru
Rostov-on-Don, Russian Federation
 Southern Federal University Tkachenko Alexey msqk@mail.ru
Rostov-on-Don, Russian Federation
 Application of the RF MEMS technology in modern wireless systems: A potential that has not yet been fully realized Today one of the key triggers of the development of research and development in the field of electronics, radio-frequency components, and systems, system integration and design, as well as information and communication technologies are such data network concepts as the Internet of Things, Internet of Everything, Tactical Internet and the most important among them is 5G – the 5th generation of mobile radio communications. This article presents a vision for the use of devices manufactured using microelectromechanical systems technology, namely passive radio-frequency microelectromechanical devices and systems in synergy with energy-harvesting microelectromechanical devices and systems in such new structural paradigms. The authors present their results on the development, manufacture and research of experimental samples of radio-frequency microelectromechanical switches that can meet the growing need for cutting-edge performance for currently deployed 5G NR FR1 (below 6 GHz) mobile networks or high-performance applications. 10.18721/JCSTCS.14202 621.318.51, 621.3.049.7 MEMS RF MEMS EH MEMS microelectromechanical systems radio-frequency energy-harvesting modern wireless systems https://infocom.spbstu.ru/article/2021.69.2/
RAR RUS 29-48 Peter the Great St. Petersburg Polytechnic University Zavorotneva Ekaterina zavorotneva.ev@gmail.com
St. Petersburg, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Indeitsev Dmitry Dmitry.indeitsev@gmail.com
St. Petersburg, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Lukin Aleksei lukin@compmechlab.com
St. Petersburg, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Popov Ivan popov_ia@spbstu.ru
St. Petersburg, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Udalov Pavel pp_udalov@mail.ru
St. Petersburg, Russian Federation
 Technique for compact modeling of thermoelectric systems This article describes a technique for modeling a thermoelectric module (TEM) based on a systematic approach using compact models. A finite-element model of a Peltier battery was built in the COMSOL software environment. A numerical analysis of the characteristics of TEM in the case of the dependence of material parameters on temperature is carried out. A compact dynamic TEM model has been constructed and verified on the basis of direct numerical modeling of a number of stationary and non-stationary problems for TEM. The presented approach facilitates the modeling of a thermoelectric module and its interrelationships with control units and other thermal elements under various boundary and initial conditions. The simulation results are in good agreement with the results obtained using other models described in the literature, as well as with numerical solutions. Based on numerical experiments, it is noted that the dependence of the physical parameters of the Peltier battery on temperature can distort the output parameters of the TEM and, if possible, should be taken into account in a compact model. 10.18721/JCSTCS.14203 681.5.01 thermoelectric module system reduction compact model Matlab Comsol sssMOR https://infocom.spbstu.ru/article/2021.69.3/
RAR RUS 49-64 Kazakin Aleksey keha@newmail.ru Peter the Great St. Petersburg Polytechnic University Kleimanov Roman kleimanovrv@mail.ru
St. Petersburg, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Korshunov Andrey korshunov@spbstu.ru
St. Petersburg, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Akulshin Yurii akulshin_yud@spbstu.ru
St. Petersburg, Russian Federation
 S.I. Vavilov State Optical Institute Shashkin Aleksandr shashkin@goi.ru
St. Petersburg, Russian Federation
 MEMS alkali vapor cell encapsulation technologies for chip-scale atomic clock The article is dedicated to solving the problem of creation of small-size quantum frequency standards for telecommunications and navigation systems using the methods of MEMS technologies. The analysis of the conventional MEMS atomic clocks operating on the effect of coherent population trapping shows that the conditions of the technological operation for alkali vapor cells sealing have the greatest influence on the clock performance. To improve the atomic clock short-term and long-term frequency stability, it is necessary to reduce the cell sealing temperature and use materials with low gas permeability. Therefore, experimental work was carried out to find new structural materials for the atomic cell design and two MEMS technologies of low-temperature anodic bonding were developed. The first one is based on the use of transparent glass-ceramics SO-33M and provides anodic sealing at a temperature of 150 °C. Using this technology, prototypes of MEMS cells with optical windows made of glass-ceramic and fused quartz were made. The second technology is based on the anodic bonding of LK5 glass and silicon at a temperature of 250 °C and was used to fabricate MEMS cells filled with vapors of rubidium-87 or caesium-133 isotopes in neon buffer gas. 10.18721/JCSTCS.14204 621.3 MEMS atomic clock alkali vapor cell anodic bonding glass glass-ceramics quantum frequency standard https://infocom.spbstu.ru/article/2021.69.4/
RAR RUS 65-78 0000-0003-3103-7060 Peter the Great St.Petersburg Polytechnic University Loboda Vera
Polytechnicheskaya, 29, St.Petersburg, 195251, Russian Federation
 Peter the Great St. Petersburg Polytechnic University Salamatova Ulyana salamatova.uv@edu.spbstu.ru
St. Petersburg, Russian Federation
 Capacitive MEMS microphones for medical applications Microphones manufactured based on MEMS technology have been significantly applied in medicine. However, medical application requires more sensitive and low-frequency MEMS microphones. To achieve this goal capacitive microphones are the most appropriate as they have a low level of noise and high sensitivity compared to piezoelectric and piezoresistive microphones. The structure and materials enable to change electric parameters of microphones for better. To increase sensitivity it is possible to find a membrane structure when internal mechanical resistivity is minimal. When MEMS structures are ideally found, a frequencies range can be expanded. Membrane flexibility can be expanded by means of applying meshes at the edges, corrugations and springs. 10.18721/JCSTCS.14205 621.3.049.7 MEMS capacitive microphone low frequency microphone sensitivity membrans https://infocom.spbstu.ru/article/2021.69.5/
RAR RUS 79-92 Concern CSRI Elektropribor, JSC Tulaev Artyom artulaev@gmail.com
St. Petersburg, Russian Federation
 Concern CSRI Elektropribor, JSC Styazhkina Anna anna_yakimov@mail.ru
St. Petersburg, Russian Federation
 Concern CSRI Elektropribor, JSC Kozlov Alexey kas573@yandex.ru
St. Petersburg, Russian Federation
 Belyaev Yakov designcenter.spb@mail.ru Micromechanical sensors design method based on system-level modeling This paper proposes a design method for micromechanical inertial sensors with force feedback electromechanical loop with delta-sigma modulator. Development of such sensors requires application of modern design methods, including modeling at system level, model refinement based on results of finite element modeling and modeling of individual electronic blocks at circuit level, as well as implementation of a digital twin based on results of an experimental study of sensors samples. Such a complex approach to sensor design is caused by high requirements to sensor characteristics (both in terms of dynamic range and accuracy), the need to consider the impact of external factors and the various physics to describe the processes, the impossibility of rapid prototyping, the influence of technological process parameters on sensor characteristics, etc. In this regard, this paper proposes a comprehensive method for the design of micromechanical sensors based on the construction of the system model. This paper represents the results of an experimental study of the force feedback type sensor using the proposed method. 10.18721/JCSTCS.14206 531.383 micromechanical sensor MEMS delta-sigma modulator system level model digital twin https://infocom.spbstu.ru/article/2021.69.6/